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This study explores the microreactor-assisted soft lithography (MASL) method for direct, one-step synthesis and patterning of additive-free antimony sulfide (Sb₂S₃) nanostructured thin films. 

Abstract This paper explores the production of an oxide dispersion strengthened (ODS) 304L stainless steel microchannel heat exchanger (HX) using a hybrid additive manufacturing process of laser powder bed fusion and inkjet printing. The study investigates the capabilities and economics of the hybrid inkjet-laser powder bed fusion (LPBF) process and evaluates the dimensional accuracy, functionality, and mechanical properties of the resulting ODS alloy. The effectiveness and pressure drop of the ODS heat exchangers produced by the hybrid LPBF tool are also determined. Results show that the inkjet-doped samples have a lower mean channel height with higher standard deviation than samples produced by LPBF alone. This is attributed to greater absorption of laser energy for the powder coated with the oxide precursor. The economic analysis shows that the hybrid process has a potential for reducing the unit cost of the heat exchanger based on cost modeling assumptions. 

Microfluidics, involving chemical or physical phenomena at the submillimeter length scale under continuous flow, allows the controlled reaction, assembly, and exfoliation of nanomaterials by adjusting the momentum, heat, and mass transfer. 

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored. 

Printing enabled solution processing of semiconductors, especially Cu-based films, is an inexpensive and low-energy fabrication route for p-type thin-film transistors that are critical components of printed electronics. The state-of-the-art route is limited by a gap between ink compositions that are printable and ink compositions that enable high electrical performance at low processing temperatures. We overcome this gap based on the insight that the hole density of CuI can be tuned by alloying with CuBr while achieving a higher on/off ratio due to the lower formation energy of copper vacancies in CuBr than in CuI. We develop stable and printable precursor inks from binary metal halides that undergo post-printing recrystallization into a dense CuBrI thin film at temperatures as low as 60 °C. Adjusting the CuI/CuBr ratio affects the electrical properties. CuBr 0.2 I 0.8 films achieve the highest field-effect mobility among CuI based thin-film transistors (9.06 ± 1.94 cm 2 V −1 s −1 ) and an average on/off ratio of 10 2 –10 5 at a temperature of 150 °C. This performance is comparable to printed n-type Cu-based TFT that needs temperatures as high as 400 °C. (mobility = 0.22 cm 2 V −1 s −1 , on/off ratio = 10 3 ). The developed low-temperature processing capability is used to inkjet print textile-based CuBrI thin-film transistors at a low temperature of 60 °C to demonstrate the potential for printing complementary circuits in wearable electronic textiles. 

Abstract Vapor printing technologies are emerging as powerful tools for device fabrication due to their unique solvent‐free nature. In recent years, a few articles have been published to investigate these printing technologies for applications such as organic light‐emitting diodes (OLEDs), circuits, sensors, photodetectors, and drug screening. These printing technologies are physical vapor printing methods based on ablation, evaporation, and condensation. In this perspective, the advancement of vapor printing technologies is highlighted and introduce an additional approach enabling the chemistry of molecular precursors to be fully exploited dynamically. These additional concepts of vapor printing are introduced from the perspective of the printer's design and the development of process strategies with supporting original data. Furthermore, potential applications, challenges, and outlook are discussed. Specifically, this outlook appeals to researchers involved in nanostructured materials, semiconductors, catalysts, alloys, metals, polymers, functionally gradient materials, multi‐material structures, and additive manufacturing (AM) from academia and industries alike.